A semiconductor device according to the present embodiment includes an insulating film provided above a semiconductor substrate. A plurality of upper-layer wirings are provided on the insulating film. A plurality of lower-layer wirings are provided in the insulating film. The lower-layer wirings are respectively located between the upper-layer wirings adjacent to each other when viewed from above the semiconductor substrate. Side surfaces of the lower-layer wirings substantially match surfaces of the upper-layer wirings present on both sides of the lower-layer wirings, respectively when viewed from above the semiconductor substrate.