发明申请
US20140362590A1 ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE
审中-公开
电子模块，照明设备和电子模块的制造方法
- 专利标题： ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE
- 专利标题（中）： 电子模块，照明设备和电子模块的制造方法
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申请号： US14238204申请日： 2012-08-10
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公开(公告)号： US20140362590A1公开(公告)日： 2014-12-11
- 发明人: Peng Chen , Xiaomian Chen , Yaojun Feng , Hao Li
- 申请人： Peng Chen , Xiaomian Chen , Yaojun Feng , Hao Li
- 申请人地址： DE Muenchen
- 专利权人： OSRAM GMBH
- 当前专利权人： OSRAM GMBH
- 当前专利权人地址： DE Muenchen
- 优先权： CN201110235306.1 20110816
- 国际申请： PCT/EP2012/065712 WO 20120810
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; F21V29/00 ; H05K3/28
摘要：
An electronic module to be mounted on a mounting surface may include: a circuit board provided with a heat source, wherein a thermal via is formed through the circuit board and is in thermal contact with the heat source; and a potting material packaging the circuit board at least at the other side opposite to one side of heat source, wherein the potting material has a recess formed in at least part of an area corresponding to the thermal via at the other side of the circuit board and a thermal conductive material, which is thermal-conductively connected to the mounting surface, is filled in the recess.