The present invention provides a substrate double-surface hole-filling apparatus for carrying out a hole-filling operation on a substrate which has a first surface and a second surface, comprises a first feeding device, a first scraping device, a first drying device, a second feeding device, a second scraping device, a second drying device and a turnover device. The substrate double-surface hole-filling apparatus has a turnover device turning over the substrate which needs to be carried out with hole-filling operation. Therefore, the substrate double-surface hole-filling apparatus can automatically carry out the hole-filling operation on two surfaces of the substrate without manual turnover of the substrate, thus improving production efficiency.