Various embodiments may provide a circuit arrangement. The circuit arrangement may include a carrier having at least one electrically conductive line; a plurality of discrete encapsulated integrated circuits arranged on the carrier; wherein a first integrated circuit of the plurality of integrated circuits is in electrical contact with a second integrated circuit of the plurality of integrated circuits to form a first current path bypassing the carrier; and wherein the first integrated circuit of the plurality of integrated circuits is in electrical contact with the second integrated circuit of the plurality of integrated circuits to form a second current path via the at least one electrically conductive line.