There is provided a method of manufacturing a multilayer ceramic electronic component, the method including: preparing a ceramic multilayer body by stacking and sintering ceramic green sheets having internal electrodes formed thereon; determining whether or not a distance d1 from an edge of a side surface of the ceramic multilayer body to the internal electrode exceeds 8.0 μm; and forming a reinforcing layer on the side surface when the distance d1 ranges from 0.1 μm to 8.0 μm.