Invention Application
- Patent Title: MICRO PUMP DEVICE
- Patent Title (中): 微型泵装置
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Application No.: US14015615Application Date: 2013-08-30
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Publication No.: US20140377098A1Publication Date: 2014-12-25
- Inventor: Sang Jin KIM , Bo Sung KU
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2013-0070422 20130619
- Main IPC: F04B43/04
- IPC: F04B43/04
Abstract:
There is provided a micro pump device including a micro pump, and a housing receiving the micro pump and provided with a pipe connection port.
Information query
