Invention Application
US20150000838A1 APPARATUS FOR TEMPORARY BONDING OF SUBSTRATE ON A CARRIER AND METHOD THEREOF
有权
用于载体上基板的临时结合的装置及其方法
- Patent Title: APPARATUS FOR TEMPORARY BONDING OF SUBSTRATE ON A CARRIER AND METHOD THEREOF
- Patent Title (中): 用于载体上基板的临时结合的装置及其方法
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Application No.: US14090015Application Date: 2013-11-26
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Publication No.: US20150000838A1Publication Date: 2015-01-01
- Inventor: HAYK KHACHATRYAN
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-City
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-City
- Priority: KR10-2013-0075576 20130628
- Main IPC: B32B37/06
- IPC: B32B37/06 ; B32B37/12
Abstract:
An apparatus for temporarily bonding a substrate on a carrier includes an electrically conductive adhesion layer disposed between the carrier and the substrate, and a current supply source configured to apply a current to the electrically conductive adhesion layer.
Public/Granted literature
- US09352541B2 Apparatus for temporary bonding of substrate on a carrier and method thereof Public/Granted day:2016-05-31
Information query
