发明申请
- 专利标题: RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
- 专利标题(中): 在半导体封装中的无线电频率屏蔽
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申请号: US13931902申请日: 2013-06-29
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公开(公告)号: US20150001689A1公开(公告)日: 2015-01-01
- 发明人: Edmund Goetz , Bernd Memmler , Jan-Erik Mueller , Peter Baumgartner
- 申请人: Edmund Goetz , Bernd Memmler , Jan-Erik Mueller , Peter Baumgartner
- 主分类号: H01L23/552
- IPC分类号: H01L23/552 ; H01L25/00
摘要:
Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.
公开/授权文献
- US09362233B2 Radio frequency shielding within a semiconductor package 公开/授权日:2016-06-07