Invention Application
- Patent Title: THICKNESS MEASURING APPARATUS AND THICKNESS MEASURING METHOD
- Patent Title (中): 厚度测量装置和厚度测量方法
-
Application No.: US14323211Application Date: 2014-07-03
-
Publication No.: US20150012246A1Publication Date: 2015-01-08
- Inventor: Jae-Wan KIM , Jong-Ahn KIM , Chu-Shik KANG , Jong-Han JIN
- Applicant: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE
- Priority: KR10-2013-0078751 20130705
- Main IPC: G01B11/06
- IPC: G01B11/06

Abstract:
Provided are a thickness measuring apparatus and a thickness measuring method. The thickness measuring method includes irradiating first laser beam of a first wavelength λ1 to a transparent substrate and measuring intensity of first laser beam transmitting the transparent substrate; irradiating second laser beam of a second wavelength λ2 to the transparent substrate and measuring intensity of second laser beam transmitting the transparent substrate; and extracting a rotation angle on a Lissajous graph using the first and second laser beams transmitting the transparent substrate. A phase difference between adjacent rays by multiple internal reflection of the first laser beam and a phase difference between adjacent ray by multiple internal reflection of the second laser beam is maintained at π/2.
Public/Granted literature
- US09921051B2 Thickness measuring apparatus and thickness measuring method Public/Granted day:2018-03-20
Information query