Invention Application
- Patent Title: COLD CHASSIS FOR ELECTRONIC MODULES AND METHOD OF MAKING SAME
- Patent Title (中): 电子模块的冷库及其制造方法
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Application No.: US14492818Application Date: 2014-09-22
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Publication No.: US20150013939A1Publication Date: 2015-01-15
- Inventor: David H. Altman , Scott R. Cheyne , Anurag Gupta
- Applicant: Raytheon Company
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.
Public/Granted literature
- US09526192B2 Cold chassis for electronic modules and method of making same Public/Granted day:2016-12-20
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