Invention Application
- Patent Title: INSULATING MATERIAL, PASSIVE ELEMENT, CIRCUIT BOARD, AND METHOD OF MANUFACTURING AN INSULATING SHEET
- Patent Title (中): 绝缘材料，被动元件，电路板和制造绝缘片的方法
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Application No.: US14311546Application Date: 2014-06-23
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Publication No.: US20150014039A1Publication Date: 2015-01-15
- Inventor: Masaya Nogi , Katsuaki Suganuma , Hirotaka Koga , Natsuki Komoda , Hirofumi Matsumoto , Masayuki Iwase , Kazayuki Ozaki , Keizo Toyama
- Applicant: NIPPON MEKTRON, LTD. , OSAKA UNIVERSITY
- Applicant Address: JP Tokyo JP Osaka
- Assignee: NIPPON MEKTRON, LTD.,OSAKA UNIVERSITY
- Current Assignee: NIPPON MEKTRON, LTD.,OSAKA UNIVERSITY
- Current Assignee Address: JP Tokyo JP Osaka
- Priority: JP2013-145390 20130711
- Main IPC: H01G4/16
- IPC: H01G4/16 ; D21H21/14 ; D21H11/10 ; H05K1/18
Abstract:
Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked on the high-k layer.
Public/Granted literature
- US09620286B2 Insulating material, passive element, circuit board, and method of manufacturing an insulating sheet Public/Granted day:2017-04-11
Information query
