In one exemplary embodiment of the invention, an electrical grounding device for dissimilar metals is provided. The device includes a body comprising adjacent first and second plate portions, the body including a first surface formed from a first metal and an opposite second surface formed from a second metal. The first plate portion is folded onto the second plate portion such that a portion of the first surface of the first plate portion contacts a portion of the first surface of the second plate portion. The first surface of the first plate portion is configured to couple to a first component formed from the first metal and the second surface of the second plate portion is configured to couple to a second component formed from the second metal, the body electrically coupling the first component and the second component to facilitate electrically connecting the first and second components.