An electroplating apparatus for plating a metal onto a surface of a wafer is disclosed. The apparatus comprises a wafer support configured to support a wafer and a processing base. The processing base has a scroll pump oriented to pump a plating solution in a substantially perpendicular direction with respect to the surface of the wafer. Further, the scroll pump includes a first scroll and a second scroll, at least one of which is configured as an anode. In one embodiment, the processing base includes an anolyte chamber including the scroll pump, a catholyte chamber, and a membrane separating the anolyte chamber from the catholyte chamber.