Invention Application
- Patent Title: METHODS OF FORMING A SEMICONDUCTOR DEVICE
- Patent Title (中): 形成半导体器件的方法
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Application No.: US13940545Application Date: 2013-07-12
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Publication No.: US20150017746A1Publication Date: 2015-01-15
- Inventor: Cheong Sik Yu , Choelhwyi Bae , JaeHoo Park , Knut Stahrenberg
- Applicant: INFINEON TECHNOLOGIES AG , SAMSUNG ELECTRONICS CO., LTD.
- Main IPC: H01L21/66
- IPC: H01L21/66

Abstract:
A method of forming a semiconductor device includes forming a first transistor and a second transistor on a substrate, monitoring processes of forming the first and second transistors to find an error and performing an additional ion implantation process to form a low-concentration dopant region or a halo region on the first transistor or the second transistor corresponding to a found error.
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Information query
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