An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a first member including a plurality of suction holes formed in a surface thereof, the plurality of suction holes being connectable to a decompression source, and a second member capable of contacting the plurality of suction holes, the second member being movable relative to the first member, wherein the second member includes connecting member connecting some of the suction holes, the number of which corresponds to a relative position between the first member and the second member, to the decompression source.