Invention Application
- Patent Title: BULK FINFET SEMICONDUCTOR-ON-NOTHING INTEGRATION
- Patent Title (中): 大容量FINFET半导体无关集成
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Application No.: US13964009Application Date: 2013-08-09
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Publication No.: US20150041898A1Publication Date: 2015-02-12
- Inventor: Nicolas Loubet , Prasanna Khare , Jin Cho
- Applicant: GLOBALFOUNDRIES Inc. , STMicroelectronics, Inc.
- Applicant Address: KY Grand Cayman US TX Coppell
- Assignee: GLOBALFOUNDRIES Inc.,STMicroelectronics, Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.,STMicroelectronics, Inc.
- Current Assignee Address: KY Grand Cayman US TX Coppell
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78

Abstract:
Methods and structures for forming fully insulated finFETs beginning with a bulk semiconductor substrate are described. Fin structures for finFETs may be formed in two epitaxial layers that are grown over a bulk substrate. A first epitaxial layer may be sacrificial. A final gate structure may be formed around the fin structures, and the first epitaxial layer removed to form a void between a fin and the substrate. The void may be filled with an insulator to fully insulate the fin.
Public/Granted literature
- US09166023B2 Bulk finFET semiconductor-on-nothing integration Public/Granted day:2015-10-20
Information query
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