发明申请
- 专利标题: MICROWAVE RESONANT CAVITY
- 专利标题(中): 微波谐振腔
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申请号: US13966930申请日: 2013-08-14
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公开(公告)号: US20150048905A1公开(公告)日: 2015-02-19
- 发明人: Wen Chi FU
- 申请人: MICROELECTRONICS TECHNOLOGY, INC.
- 申请人地址: TW Hsinchu
- 专利权人: MICROELECTRONICS TECHNOLOGY, INC.
- 当前专利权人: MICROELECTRONICS TECHNOLOGY, INC.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01P7/06
- IPC分类号: H01P7/06
摘要:
A microwave resonant cavity includes a conductive shell with a screw hole having first threads and a screw having second threads configured to engage with the screw hole. The conductive shell defines a volume, the screw extends into the volume, the microwave resonant cavity has a resonant frequency, and the movement of the screw changes the resonant frequency. The first threads have a first pitch, and at least a portion of the second threads has a second pitch different from the first pitch.
公开/授权文献
- US09112251B2 Microwave resonant cavity 公开/授权日:2015-08-18