Invention Application
- Patent Title: COIL UNIT FOR THIN FILM INDUCTOR, MANUFACTURING METHOD OF COIL UNIT FOR THIN FILM INDUCTOR, THIN FILM INDUCTOR AND MANUFACTURING METHOD OF THIN FILM INDUCTOR
- Patent Title (中): 薄膜电感线圈单元,薄膜电感线圈单元的制造方法,薄膜电感器及薄膜电感器的制造方法
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Application No.: US14460022Application Date: 2014-08-14
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Publication No.: US20150048918A1Publication Date: 2015-02-19
- Inventor: Jeong Woo PARK , Seon Ha KANG , Oh Hi LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Priority: KR10-2013-0096649 20130814
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F41/04

Abstract:
Embodiments of the invention provide a coil unit for a thin film inductor, a manufacturing method of a coil unit for a thin film inductor, a thin film inductor, and a manufacturing method of a thin film inductor. According to an embodiment, there is provided a coil unit for a thin film inductor. The coil unit includes an insulator having a dual insulating layer of different materials, and coil patterns respectively embedded in upper and lower surfaces of the insulator. The coil patterns include a coil pattern formed of a plurality of plating layers.
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