Invention Application
- Patent Title: THERMALLY HEALABLE AND RESHAPABLE CONDUCTIVE HYDROGEL COMPOSITE
- Patent Title (中): 热稳定和可再生导电氢化复合材料
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Application No.: US14463884Application Date: 2014-08-20
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Publication No.: US20150053896A1Publication Date: 2015-02-26
- Inventor: Jae-hyun HUR , No-kyoung PARK , Kyu-hyun IM , Sang-won KIM , Sung-woo HWANG , Jang-wook CHOI
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR DAEJEON-SI KR SUWON-SI
- Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY,SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY,SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR DAEJEON-SI KR SUWON-SI
- Priority: KR10-2013-0101278 20130826
- Main IPC: A61L27/60
- IPC: A61L27/60 ; H01B1/22 ; A61L27/50 ; A61L27/48 ; A61L27/52

Abstract:
An electro-conductive hydrogel composite material that may be suitable as an artificial skin satisfies all four requirements of artificial skin, namely, flexibility, electrical conductivity, healing property, and biocompatibility. The electro-conductive hydrogel composite material includes a hydrogel composition including water and a cross-linkable polymer which reversibly forms cross-linkage by hydrogen bonding; and an electro-conductive material dispersed in the hydrogen bond-based hydrogel.
Public/Granted literature
- US09757496B2 Thermally healable and reshapable conductive hydrogel composite Public/Granted day:2017-09-12
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