Invention Application
- Patent Title: APPARATUS AND METHOD FOR CONFIGURABLE REDUNDANT FUSE BANKS
- Patent Title (中): 可配置冗余保险丝库的设备和方法
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Application No.: US13972609Application Date: 2013-08-21
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Publication No.: US20150058598A1Publication Date: 2015-02-26
- Inventor: G. Glenn Henry , Dinesh K. Jain
- Applicant: VIA Technologies, INC.
- Applicant Address: TW New Taipei City
- Assignee: VIA TECHNOLOGIES, INC.
- Current Assignee: VIA TECHNOLOGIES, INC.
- Current Assignee Address: TW New Taipei City
- Main IPC: G06F9/38
- IPC: G06F9/38 ; G06F9/50

Abstract:
An apparatus is contemplated for storing and providing configuration data to an integrated circuit device, the apparatus has a fuse array and a plurality of cores. The fuse array is disposed on a die. The fuse array has a first plurality of semiconductor fuses and a second plurality of semiconductor fuses. The plurality of cores is disposed on the die, where each of the plurality of cores is coupled to the fuse array. The each of the plurality of cores includes array control, configured to access the first and second pluralities of fuses, and configured to process first states of the first plurality of semiconductor fuses and second states of the second plurality of semiconductor fuses according to contents of a configuration data register.
Information query