发明申请
- 专利标题: Interposer Defect Coverage Metric and Method to Maximize the Same
- 专利标题(中): 内插器缺陷覆盖度量度和最大化方法
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申请号: US14087650申请日: 2013-11-22
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公开(公告)号: US20150058819A1公开(公告)日: 2015-02-26
- 发明人: Sandeep Kumar Goel , Ashok Mehta
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: G06F17/50
- IPC分类号: G06F17/50 ; H01L27/02
摘要:
Provided is a method of assigning a first set of probe pads to an interposer for maximizing a defect coverage for the interposer. The interposer includes a second set of nets and the defect coverage is based on a ratio between a tested net length and an overall net length. The method includes processing the second set such that every net interconnecting more than two micro-bumps is divided into a plurality of nets and every two of the more than two micro-bumps are interconnected by one of the plurality of nets. The method further includes calculating an untested length of each net in the second set; selecting a first net from the second set with the maximum untested length; selecting two probe pads from the first set based on a user-defined cost function; and connecting the two probe pads to the first net with two dummy nets.
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