发明申请
US20150069638A1 METALLIC PARTICLE PASTE, CURED PRODUCT USING SAME, AND SEMICONDUCTOR DEVICE
审中-公开
金属颗粒膏,使用相同的固化产品和半导体器件
- 专利标题: METALLIC PARTICLE PASTE, CURED PRODUCT USING SAME, AND SEMICONDUCTOR DEVICE
- 专利标题(中): 金属颗粒膏,使用相同的固化产品和半导体器件
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申请号: US14337624申请日: 2014-07-22
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公开(公告)号: US20150069638A1公开(公告)日: 2015-03-12
- 发明人: Daisuke HIRATSUKA , Tomohiro IGUCHI , Masayuki UCHIDA
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Minato-ku
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Minato-ku
- 优先权: JP2013-187709 20130910
- 主分类号: B23K35/02
- IPC分类号: B23K35/02 ; H01L23/00 ; B23K35/24
摘要:
According to one embodiment, a metallic particle paste includes a polar solvent and particles dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent.