发明申请
- 专利标题: Method and System of Surface Polishing
- 专利标题(中): 表面抛光方法与系统
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申请号: US14095937申请日: 2013-12-03
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公开(公告)号: US20150075558A1公开(公告)日: 2015-03-19
- 发明人: Kangmin Hsia
- 申请人: Kangmin Hsia
- 主分类号: B24B1/00
- IPC分类号: B24B1/00
摘要:
A method of polishing a surface of an object disposed within a gas chamber is provided. The method includes filling the gas chamber with a discharging medium to a predefined pressure, applying a voltage between an electrode and the surface, calibrating a height of the electrode relative to the surface so as to establish electrical breakdown threshold criteria, and scanning the electrode with respect to the surface so as to sequentially position the electrode over a plurality of locations on the surface, each location characterized by a surface error. When a respective location in the plurality of locations has a surface error that meets the electrical breakdown threshold criteria, electrical breakdown occurs, whereby the electrical breakdown results in a discharging pulse that polishes the surface.
公开/授权文献
- US09586279B2 Method and system of surface polishing 公开/授权日:2017-03-07
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