发明申请
- 专利标题： POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHOD
- 专利标题（中）： 功率半导体器件封装和制造方法
-
申请号： US14029555申请日： 2013-09-17
-
公开(公告)号： US20150076676A1公开(公告)日： 2015-03-19
- 发明人: Jun Lu , François Hébert , Kai Liu , Xiaotian Zhang
- 申请人： Jun Lu , François Hébert , Kai Liu , Xiaotian Zhang
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L25/07
摘要：
A power semiconductor device package includes a conductive assembly including a connecting structure and a semiconductor die having an aperture formed therethrough, the aperture being sized and configured to spacedly receive the connecting structure. In an alternative embodiment, a power semiconductor device package includes a conductive assembly including a connecting structure and a pair of semiconductor die disposed on either side of the connecting structure in spaced relationship thereto.
信息查询
IPC分类:
