Invention Application
US20150087145A1 Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive
审中-公开
芯片组成集成电路，制作方法和方法，用于局部渲染碳层导电
- Patent Title: Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive
- Patent Title (中): 芯片组成集成电路，制作方法和方法，用于局部渲染碳层导电
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Application No.: US14555297Application Date: 2014-11-26
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Publication No.: US20150087145A1Publication Date: 2015-03-26
- Inventor: Uwe Hoeckele
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/768
- IPC: H01L21/768
Abstract:
A chip includes an integrated circuit and a carbonic layer. The carbonic layer includes a graphite-like carbon, wherein a lateral conducting path through the graphite-like carbon electrically connects two circuit elements of the integrated circuit.
Information query
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