Invention Application
- Patent Title: METAL WIRE, THIN-FILM TRANSISTOR SUBSTRATE AND METHOD FOR MANUFACTURING A THIN-FILM TRANSISTOR SUBSTRATE
- Patent Title (中): 金属线，薄膜晶体管基板及制造薄膜晶体管基板的方法
-
Application No.: US14493241Application Date: 2014-09-22
-
Publication No.: US20150091004A1Publication Date: 2015-04-02
- Inventor: Kyung-Seop Kim , Byeong-Beom Kim , Sang-Won Shin , Dae-Young Lee , Chang-Oh Jeong , Joon-Yong Park , Dong-Min Lee
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Priority: KR10-2013-0114944 20130927
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/66 ; H01L29/786
Abstract:
A metal wire included in a display device, the metal wire includes a first metal layer including a nickel-chromium alloy, a first transparent oxide layer disposed on the first metal layer, and a second metal layer disposed on the first transparent oxide layer.
Public/Granted literature
- US09318510B2 Metal wire, thin-film transistor substrate and method for manufacturing a thin-film transistor substrate Public/Granted day:2016-04-19
Information query
IPC分类:
