Invention Application
- Patent Title: MICROPHONE
- Patent Title (中): 麦克风
-
Application No.: US14457093Application Date: 2014-08-11
-
Publication No.: US20150092964A1Publication Date: 2015-04-02
- Inventor: Byung Hun Kim , Hwa Sun Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Priority: KR10-2013-0116383 20130930; KR10-2013-0126091 20131022
- Main IPC: H04R1/08
- IPC: H04R1/08

Abstract:
Disclosed herein is a microphone including: a membrane; a fixed electrode part positioned at the outside of the membrane; and an elastic support part connecting the membrane and the fixed electrode part to each other so as to enable displacement of the membrane, wherein one surface of the membrane and one surface of the fixed electrode part facing each other are formed with conductive parts, respectively.
Information query