Invention Application
- Patent Title: Single Silicon Wafer Micromachined Thermal Conduction Sensor
- Patent Title (中): 单硅晶片微加工热传导传感器
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Application No.: US14045555Application Date: 2013-10-03
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Publication No.: US20150097260A1Publication Date: 2015-04-09
- Inventor: Xiang Zheng Tu
- Applicant: Xiang Zheng Tu
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00 ; G01N25/18

Abstract:
A single silicon wafer micromachined thermal conduction sensor is described. The sensor consists of a heat transfer cavity with a flat bottom and an arbitrary plane shape, which is created in a silicon substrate. A heated resistor with a temperature dependence resistance is deposed on a thin film bridge, which is the top of the cavity. A heat sink is the flat bottom of the cavity and parallel to the bridge completely. The heat transfer from the heated resistor to the heat sink is modulated by the change of the thermal conductivity of the gas or gas mixture filled in the cavity. This change can be measured to determine the composition concentration of the gas mixture or the pressure of the air in a vacuum system.
Public/Granted literature
- US09440847B2 Single silicon wafer micromachined thermal conduction sensor Public/Granted day:2016-09-13
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