发明申请
- 专利标题： OPTICALLY CONNECTING A CHIP PACKAGE TO AN OPTICAL CONNECTOR
- 专利标题（中）： 将芯片包装光学连接到光连接器
-
申请号： US14395996申请日： 2012-07-27
-
公开(公告)号： US20150098680A1公开(公告)日： 2015-04-09
- 发明人: Kevin B. Leigh , George D. Megason , Paul Kessler Rosenberg
- 申请人： Kevin B. Leigh , George D. Megason , Paul Kessler Rosenberg
- 国际申请： PCT/US12/48500 WO 20120727
- 主分类号： G02B6/42
- IPC分类号： G02B6/42
摘要：
An optical communication module has an attachment feature for attachment to a chip package having an electrical-optical converter, the optical communication module to pass light communicated with an electrical-optical converter of the chip package. The optical communication module has an alignment feature to achieve a level of alignment with a system-side optical connector.
信息查询
