Invention Application
- Patent Title: A METHOD OF POLISHING A SUBSTRATE HAVING A FILM ON A SURFACE OF THE SUBSTRATE FOR SEMICONDUCTOR MANUFACTURING
- Patent Title (中): 用于半导体制造的基板表面上的薄膜基板的抛光方法
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Application No.: US14589988Application Date: 2015-01-05
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Publication No.: US20150111314A1Publication Date: 2015-04-23
- Inventor: Takeshi IIZUMI , Katsuhide WATANABE , Yoichi KOBAYASHI
- Applicant: EBARA CORPORATION
- Priority: JP2012-154975 20120710
- Main IPC: H01L21/321
- IPC: H01L21/321 ; B24B49/12 ; H01L21/67 ; B24B37/013 ; H01L21/66 ; H01L21/3105
Abstract:
A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type film thickness measuring device prior to cleaning and drying of the substrate; measuring a thickness of the film by the wet-type film thickness measuring device; comparing the thickness with a predetermined target value; and if the thickness has not reached the predetermined target value, performing re-polishing of the substrate in the polishing section prior to cleaning and drying of the substrate.
Information query
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