There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor including first and second external electrodes formed of a conductive paste on both ends of a ceramic body; and an interposer substrate attached to a mounting surface of the multilayer ceramic capacitor and including first and second connection terminals connected to the first and second external electrodes at both ends of an insulation substrate, respectively, the first and second connection terminals having a double-layer structure including first and second conductive resin layers and first and second plating layers formed on the first and second conductive resin layers.