Invention Application
- Patent Title: POLISHING PAD AND METHOD FOR MANUFACTURING SAME
- Patent Title (中): 抛光垫及其制造方法
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Application No.: US14397542Application Date: 2013-02-12
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Publication No.: US20150133039A1Publication Date: 2015-05-14
- Inventor: Bong-Su Ahn , Young-Jun Jang , Jin-Su Jeong , Sang-Mok Lee , Kee-Cheon Song , Seung-Geun Kim , Jang-Won Seo , Jeong-Seon Choo , Hak-Su Kang , Gyoung-Pyo Kong
- Applicant: KPX CHEMICAL CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2012-0054523 20120523
- International Application: PCT/KR2013/001085 WO 20130212
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24D11/00

Abstract:
Polishing pad and method of manufacturing the same, the method, whereby materials for forming a polishing layer are mixed and solidified by a chemical reaction so as to manufacture the polishing pad, the method including: grinding organic materials by using a physical method so as to form micro-organic particles; mixing the micro-organic particles formed in the operation with the materials for forming the polishing layer; mixing at least one selected from the group consisting of inert gas, a capsule type foaming agent, and a chemical foaming agent that are capable of controlling sizes of pores, with the mixture in the operation so as to form gaseous pores; performing gelling and hardening of the mixture generated in the operation so as to form a polishing layer; and processing the polishing layer so as to distribute open pores defined by opening gaseous pores on a surface of the polishing layer.
Information query