A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.