Invention Application
- Patent Title: Buck Circuit
- Patent Title (中): 降压电路
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Application No.: US14082248Application Date: 2013-11-18
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Publication No.: US20150137788A1Publication Date: 2015-05-21
- Inventor: Yang Li , Haitao Liu , Yingchun Ru , Qiuhua Zhu , Kan Chiu Seto
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H02M3/158
- IPC: H02M3/158
Abstract:
An apparatus may be provided. The apparatus may comprise a first circuit portion, a second circuit portion, and a third circuit portion. The first circuit portion may comprise a voltage supply having an input voltage level (Vin) and a first switch. The second circuit portion may comprise a plurality of parallel paths. The third circuit portion may comprise a second switch and a third switch. The plurality of parallel paths may supply a portion of the input voltage level when the first switch is open, the second switch is closed, and the third switch is open.
Public/Granted literature
- US09391515B2 Buck circuit Public/Granted day:2016-07-12
Information query
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