Invention Application
- Patent Title: dispersion for the metallization of contactings
- Patent Title (中): 用于金属化接触的分散体
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Application No.: US14554971Application Date: 2014-11-26
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Publication No.: US20150151328A1Publication Date: 2015-06-04
- Inventor: Heribert WEBER , Yvonne BERGMANN , Klaus KRUEGER , Andreas RATHJEN
- Applicant: Robert Bosch GmbH
- Priority: DE102013224622.6 20131129
- Main IPC: B05D5/00
- IPC: B05D5/00 ; B41J2/14
Abstract:
A dispersion is provided having a dispersion medium and a plurality of colloid particles finely distributed in the dispersion medium, the colloid particles being electrically conductive, the dispersion being a functional ink for the wetting of an inner wall of a contacting opening of a substrate using a print process.
Public/Granted literature
- US09324474B2 Dispersion for the metallization of contactings Public/Granted day:2016-04-26
Information query
