Invention Application
- Patent Title: Multi Integrated Switching Device Structures
- Patent Title (中): 多集成开关器件结构
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Application No.: US14617099Application Date: 2015-02-09
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Publication No.: US20150155123A1Publication Date: 2015-06-04
- Inventor: Kevin Wilson , Robert Tarzwell , Patrick McGuire
- Applicant: Telepath Networks, Inc.
- Applicant Address: US NC Raleigh
- Assignee: Telepath Networks, Inc.
- Current Assignee: Telepath Networks, Inc.
- Current Assignee Address: US NC Raleigh
- Main IPC: H01H50/20
- IPC: H01H50/20 ; H01H51/27 ; H01H50/60

Abstract:
A switching device structure having a top layer and a bottom layer, each layer comprising a body of magnetizable material, such as permalloy, disposed within a coil wherein an armature is suspended in a cavity between the top and bottom layers, the armature having ferromagnetic material disposed on a top and bottom surface thereof. Each body of magnetizable material may be pulsed by its respective coil to switch it from a magnetic state to a non-magnetic state and then subsequently pulsed by the coil to switch it from the non-magnetic state to a magnetic state.
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