Invention Application
- Patent Title: INK COMPOSITION AND CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME
- Patent Title (中): 墨水组合物和电路板及其制造方法
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Application No.: US14606777Application Date: 2015-01-27
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Publication No.: US20150156871A1Publication Date: 2015-06-04
- Inventor: Haibin LI , Wen HU , Hongye LIN
- Applicant: BYD COMPANY LIMITED
- Priority: CN201210268151.6 20120730
- Main IPC: H05K1/09
- IPC: H05K1/09 ; C09D11/52 ; H05K3/12 ; C09D167/00 ; C09D133/00 ; H05K1/02 ; C09D163/00

Abstract:
An ink composition and a circuit board and a method for producing the same are provided. The ink composition comprises: an acrylic resin; an epoxy resin; a polyester resin; a curing agent; and an active powder comprising a modified metal compound, in which the metal element of the modified metal compound is at least one selected from the group consisting of Zn, Cr, Co, Cu, Mn, Mo, and Ni.
Public/Granted literature
- US09502151B2 Ink composition and circuit board and method for producing the same Public/Granted day:2016-11-22
Information query