Invention Application
- Patent Title: ELECTRONIC CIRCUIT LAID FLAT AND CORRESPONDING THREE-DIMENSIONAL ELECTRONIC CIRCUIT
- Patent Title (中): 电子电路平板和对应三维电子电路
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Application No.: US14539035Application Date: 2014-11-12
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Publication No.: US20150156879A1Publication Date: 2015-06-04
- Inventor: Vianney Pouget , Antonio Simao
- Applicant: ZODIAC AERO ELECfRIC
- Priority: FR1361164 20131115
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11 ; H05K1/02
Abstract:
This electronic circuit, includes a set of electronic boards intended to support components and linked together by joining elements. The joining elements include curved flexible printed circuits linking two opposing ends of two electronic boards running side by side, the said curved flexible printed circuits being foldable for erecting the electronic circuit into a volume so that the electronic circuit comprises electronic boards placed opposite one another.
Public/Granted literature
- US09854675B2 Electronic circuit laid flat and corresponding three-dimensional electronic circuit Public/Granted day:2017-12-26
Information query
