Invention Application
US20150165718A1 ULTRASONIC JOINING METHOD AND ULTRASONIC JOINING DEVICE 有权
超声波接合方法和超声波接合装置

  • Patent Title: ULTRASONIC JOINING METHOD AND ULTRASONIC JOINING DEVICE
  • Patent Title (中): 超声波接合方法和超声波接合装置
  • Application No.: US14561456
    Application Date: 2014-12-05
  • Publication No.: US20150165718A1
    Publication Date: 2015-06-18
  • Inventor: Ulrich Wieduwilt
  • Applicant: Robert Bosch GmbH
  • Priority: DE102013225743.0 20131212
  • Main IPC: B31D99/00
  • IPC: B31D99/00 B32B37/06 B32B37/00
ULTRASONIC JOINING METHOD AND ULTRASONIC JOINING DEVICE
Abstract:
An ultrasonic joining method for connecting paper material (5), in particular paper, board or paperboard, comprising the following steps: introducing the paper material (5) into a gap (4) between a sonotrode (2) and an anvil (3), causing the sonotrode (2) to oscillate ultrasonically for the ultrasonic welding of the paper material (5), the paper material (5) being moistened with demineralized water (9), preferably on inner sides of joining points, before and/or during the ultrasonic welding.
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