An embossing apparatus comprises an embossing die comprising a printed relief pattern, and a resilient surface for pressing media against the embossing die to emboss features corresponding to the printed relief pattern on the media, in which the printed relief pattern comprises a number of layers of a deposited material, and in which a number of layers of the deposited material closest to the top of the printed relief pattern comprises a deposited material with a relatively lower coefficient of adhesion than layers of the deposited material disposed under the deposited material closest to the top of the printed relief pattern. A printed relief pattern for embossing media comprises a number of preliminary layers, the preliminary layers comprising a first material, and a number of terminal layers, the terminal layers comprising a second material, in which the second material has a lower adhesive coefficient than the first material.