Invention Application
- Patent Title: MICRO-WIRE CONNECTION PAD
- Patent Title (中): 微线连接垫
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Application No.: US14640458Application Date: 2015-03-06
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Publication No.: US20150181702A1Publication Date: 2015-06-25
- Inventor: Ronald Steven Cok , David Paul Trauernicht
- Applicant: Eastman Kodak Company
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09
Abstract:
A connection-pad structure includes a substrate and a An electrical conductor including a plurality of micro-wires form an electrically continuous connection pad on or in the substrate. An electrical connector is electrically connected to the electrical conductor.
Information query
