Invention Application
- Patent Title: Method for Ultra-Fast Boriding
- Patent Title (中): 超快速硼化方法
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Application No.: US14158181Application Date: 2014-01-17
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Publication No.: US20150203980A1Publication Date: 2015-07-23
- Inventor: Ali Erdemir , Vivekanand Sista , Ozgenur Kahvecioglu , Osman Levent Eryilmaz
- Applicant: Uchicago Argonne LLC
- Applicant Address: US IL Chicago
- Assignee: Uchicago Argonne LLC
- Current Assignee: Uchicago Argonne LLC
- Current Assignee Address: US IL Chicago
- Main IPC: C25D3/56
- IPC: C25D3/56

Abstract:
An article of manufacture and method of forming a borided material. An electrochemical cell is used to process a substrate to deposit a plurality of borided layers on the substrate. The plurality of layers are co-deposited such that a refractory metal boride layer is disposed on a substrate and a rare earth metal boride conforming layer is disposed on the refractory metal boride layer.
Public/Granted literature
- US09556531B2 Method for ultra-fast boriding Public/Granted day:2017-01-31
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