发明申请
- 专利标题: COMPOSITE ELECTRONIC COMPONENT AND BOARD WITH THE SAME MOUNTED THEREON
- 专利标题(中): 复合电子元件与其安装在一起的板
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申请号: US14275469申请日: 2014-05-12
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公开(公告)号: US20150213960A1公开(公告)日: 2015-07-30
- 发明人: Byeong Cheol Moon , Jae Hoon Lee , Myeong Gi Kim , Jin Woo Hahn , Soo Hwan Son
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-Si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-Si
- 优先权: KR10-2014-0009382 20140127
- 主分类号: H01G4/40
- IPC分类号: H01G4/40 ; H01G4/30 ; H01G4/12 ; H01G4/012 ; H05K1/18 ; H01F27/28 ; H01F27/29 ; H01F27/24 ; H05K1/11 ; H01G2/06 ; H01G4/248
摘要:
A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.
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