Invention Application
- Patent Title: CONTINUOUS PROCESSING DEVICE
- Patent Title (中): 连续加工装置
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Application No.: US14423045Application Date: 2013-02-25
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Publication No.: US20150217264A1Publication Date: 2015-08-06
- Inventor: Yo Doya , Hidenori Goto
- Applicant: TSUKISHIMA KIKAI CO., LTD.
- Priority: JP2012-187292 20120828
- International Application: PCT/JP2013/054740 WO 20130225
- Main IPC: B01J19/24
- IPC: B01J19/24 ; B01J19/18

Abstract:
To provide a processing device which is small but which can exhibits a sufficient processing amount and a uniform contact processing property. In the processing vessel 10, a liquid flow is set to a spiral flow, and in a contact processing field, the injection liquid A, B are injected at a center-side position with respect to an inner surface of the processing vessel so as to perform contact processing.
Public/Granted literature
- US09527058B2 Continuous processing device Public/Granted day:2016-12-27
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