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Invention Application
US20150217511A1 PROCESS FOR REMOVING EXCESS PASTY MATERIAL JOINING A PLURALITY OF SUBSTRATES 有权
移除过量材料加工多孔基板的工艺

  • Patent Title: PROCESS FOR REMOVING EXCESS PASTY MATERIAL JOINING A PLURALITY OF SUBSTRATES
  • Patent Title (中): 移除过量材料加工多孔基板的工艺
  • Application No.: US14425127
    Application Date: 2013-03-07
  • Publication No.: US20150217511A1
    Publication Date: 2015-08-06
  • Inventor: James R. Ogle , Jeremy J. Patt
  • Applicant: Dow Global Technologies LLC
  • International Application: PCT/US2013/029581 WO 20130307
  • Main IPC: B29C65/00
  • IPC: B29C65/00 ;  B08B1/00
PROCESS FOR REMOVING EXCESS PASTY MATERIAL JOINING A PLURALITY OF SUBSTRATES
Abstract:
A method comprising: a) contacting an article comprising one or more blades (10), the one or more blades (10) having a leading edge (12) curved upward and separated into prongs (14) by one or more notches (16) in the one or more blades (10), with two or more substrates joined by a pasty material overflowing at one or more seams (18), where the one or more notches (16) of the article straddle the one or more seams (18); and b) moving the article or the substrates (20,22) such that the pasty material overflowing at the one or more seams (18) is removed.
Abstract(Chinese):

一种方法，包括：a）使包括一个或多个叶片（10）的物品接触，所述一个或多个叶片（10）具有向上弯曲的前缘（12）并通过一个或多个凹口（16）分离成叉（14） 在一个或多个叶片（10）中，两个或多个基底通过在一个或多个接缝（18）处溢出的糊状材料连接，其中制品的一个或多个凹口（16）跨越一个或多个接缝（18） ）; 以及b）移动所述物品或所述基底（20,22），使得在所述一个或多个接缝（18）处溢出的糊状材料被去除。

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