发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US14313724申请日： 2014-06-24
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公开(公告)号： US20150221573A1公开(公告)日： 2015-08-06
- 发明人: Jong Sik Paek , Doo Hyun Park
- 申请人： Amkor Technology, Inc.
- 优先权： KR10-2014-0012762 20140204
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/00 ; H01L21/56
摘要：
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.
公开/授权文献
- US09484331B2 Semiconductor device and manufacturing method thereof 公开/授权日：2016-11-01
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