Invention Application
US20150221592A1 SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORMED WITH BOND WIRES
审中-公开
具有捆绑线形式的封装级解耦电容器的半导体器件
- Patent Title: SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORMED WITH BOND WIRES
- Patent Title (中): 具有捆绑线形式的封装级解耦电容器的半导体器件
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Application No.: US14170651Application Date: 2014-02-03
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Publication No.: US20150221592A1Publication Date: 2015-08-06
- Inventor: Chetan Verma , Rishi Bhooshan , Vikas Garg , Shailesh Kumar , Navas Khan Oratti Kalandar
- Applicant: Chetan Verma , Rishi Bhooshan , Vikas Garg , Shailesh Kumar , Navas Khan Oratti Kalandar
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/00
Abstract:
A decoupling capacitor (decap) for circuitry (e.g., an I/O interface) in a semiconductor die is formed using one or more pairs of (parallel) bond wires wire-bonded to bond pads on a top surface of the die. Depending on the implementation, the pairs of bond wires may be horizontally or vertically aligned and may be bonded to I/O and/or array bond pads.
Information query
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