Invention Application
- Patent Title: PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM
- Patent Title (中): 电镀设备,镀层方法和储存介质
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Application No.: US14129698Application Date: 2012-06-04
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Publication No.: US20150232994A1Publication Date: 2015-08-20
- Inventor: Yuichiro Inatomi , Takashi Tanaka , Mitsuaki Iwashita
- Applicant: Yuichiro Inatomi , Takashi Tanaka , Mitsuaki Iwashita
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP2011-144800 20110629
- International Application: PCT/JP2012/064381 WO 20120604
- Main IPC: C23C18/16
- IPC: C23C18/16 ; C23C18/18

Abstract:
A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.
Public/Granted literature
- US09777379B2 Plating apparatus, plating method and storage medium Public/Granted day:2017-10-03
Information query
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