Invention Application
- Patent Title: METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Patent Title (中): 制造半导体封装的方法
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Application No.: US14716272Application Date: 2015-05-19
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Publication No.: US20150255311A1Publication Date: 2015-09-10
- Inventor: Wan-Ting Chen , Mu-Hsuan Chan , Yi-Chian Liao , Chun-Tang Lin , Yi-Che Lai
- Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Priority: TW101126923 20120726
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/78 ; H01L23/00
Abstract:
A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element.
Public/Granted literature
- US09418874B2 Method of fabricating semiconductor package Public/Granted day:2016-08-16
Information query
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