Disclosed is an apparatus for handling electronic components on a lead frame. The apparatus comprises a singulation device configured to singulate the lead frame to thereby separate the electronic components and to position the separated electronic components alternately into at least two layers along different levels; and a guide having a plurality of lanes running along a surface of the guide, the lanes being configured to transport the separated electronic components from a first end of the guide arranged adjacent to the singulation device to a second end of the guide arranged adjacent to an output area. The lanes at the first end of the guide are alternately arranged into at least two layers having respective levels to receive the electronic components from the singulation device, whereas the lanes at the second end of the guide are arranged into a single layer along a common level for transferring the electronic components to the output area. Also disclosed is a guide suitable for use with the apparatus.